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 HD74HC1G66
Analog Switch
REJ03D0188-0800Z (Previous ADE-205-314F (Z)) Rev.8.00 Jan.27.2004
Description
The HD74HC1G66 is high-speed CMOS analog switch using silicon gate CMOS process. With CMOS low power dissipation, it provides high speed. The device has low ON resistance for good transfer characteristics and can take wide range of input voltage.
Features
* The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Electrical characteristics equivalent to the HD74HC4066 Supply voltage range : 2 to 6 V Operating temperature range : -40 to +85C * Ordering Information
Part Name HD74HC1G66CME Package Type CMPAK-5 pin Package Code CMPAK-5A Package Abbreviation CM Taping Abbreviation (Quantity) E (3,000 pcs/reel)
Rev.8.00, Jan.27.2004, page 1 of 8
HD74HC1G66
Outline and Article Indication
* HD74HC1G66
Index band Marking
H
9
CMPAK-5
= Control code
Function Table
Control L H H : High level L : Low level GND VIN VCC GND VOUT VCC Switch OFF ON
Pin Arrangement
IN/OUT 1
5
VCC
OUT/IN 2
GND
3
4 Control
(Top view)
Rev.8.00, Jan.27.2004, page 2 of 8
HD74HC1G66
Absolute Maximum Ratings
Item Supply voltage range Input voltage range *1 Output voltage range *1, 2 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation 3 at Ta = 25C (in still air) * Storage temperature Notes: Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 20 20 25 25 200 -65 to 150 Unit V V V mA mA mA mA mW C Output : H or L VI < 0 or VI > VCC VO < 0 or VO >VCC VO = 0 to VCC Test Conditions
The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Input rise / fall time (Control input 10% to 90%) Symbol VCC VI/O VO tr, tf Min 2 0 0 0 0 0 Operating temperature Ta -40 Max 6 VCC VCC 1000 500 400 85 C Unit V V V ns VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Test Conditions
Note: Unused or floating control inputs must be held high or low.
Rev.8.00, Jan.27.2004, page 3 of 8
HD74HC1G66
Electrical Characteristics
VCC Item Input voltage Symbo VIH (V) 2.0 4.5 6.0 VIL 2.0 4.5 6.0 On resistance RON 2.0 4.5 6.0 Peak on resistance RON (p) 2.0 4.5 6.0 Leak current IS (off) 6.0 Ta = 25C Min 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- 200 90 80 600 125 100 -- Max -- -- -- 0.5 1.35 1.8 450 160 130 1500 200 170 0.1
Ta = -40 to 85C
Min 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- --
Max -- -- -- 0.5 1.35 1.8 550 180 140 2000 250 210 1.0
Unit V
Test Conditions Control input only
VC = VIH VIN = VCC or GND IT = 1 mA VC = VIH VIN = 0 to VCC IIN/OUT = 1 mA VC = VIL VIN = VCC, VOUT = GND or VIN = GND, VOUT = VCC VC = VIH VIN = VCC or GND VIN = VCC or GND VIN = VCC or GND
A
IS (on) Input current Operating current IIN ICC
6.0 6.0 6.0
-- -- --
-- -- --
0.1 0.1 1.0
-- -- --
1.0 1.0 10.0
A A A
Rev.8.00, Jan.27.2004, page 4 of 8
HD74HC1G66
Switching Characteristics
VCC Item Propagation delay time Symbol tPLH, tPHL (V) 2.0 4.5 6.0 Output enable time tZH, tZL 2.0 4.5 6.0 Output disable time tHZ, tLZ 2.0 4.5 6.0 Maximum control frequency 2.0 4.5 6.0 Control input capacitance Switch I/O capacitance Feed through capacitance Power dissipation capacitance (CL = 50 pF, tr = tf = 6 ns) CIN CIN/OUT CIN-OUT CPD Ta = 25C Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- 4 -- -- 10 -- -- 14 -- 20 30 30 2.5 2.5 0.5 5 Max 50 10 9 115 23 20 115 23 20 -- -- -- 5 -- -- --
Ta = -40 to 85C
Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
Max 65 13 11 145 29 25 145 29 25 -- -- -- 5 -- -- --
Unit ns
Test Conditions RL = 10 k
ns
RL = 1 k
ns
RL = 1 k
MHz
pF pF pF pF
Rev.8.00, Jan.27.2004, page 5 of 8
HD74HC1G66
Test Circuit
* RON
VCC VC = VIH VCC VIN = VCC (ON) GND VOUT RON =
VIN-OUT 10-3
()
+
1.0 mA
-
V
VIN-OUT
* IS (off), IS (on)
VCC VC = VIL VCC A VIN = VCC or GND (OFF) GND VOUT = GND or VCC VIN = VCC or GND A VC = VIL VCC (ON) GND VOUT OPEN VCC
* tPLH, tPHL
VCC VC = VIH VCC VIN (ON) GND RL = 10 k VOUT CL = 50 pF tr = 6 ns VIN 10% VOUT tf = 6 ns VCC 10% tPHL GND VOH VOL
90% 90% 50% 50% tPLH 50%
50%
Rev.8.00, Jan.27.2004, page 6 of 8
HD74HC1G66
* tZH, tZL / tHZ, tLZ
VCC
VC VCC GND
RL = 1 k VOUT CL = 50 pF S2 RL = 1 k
tr = 6 ns VC 10% 90% 50% tZH 50%
tf = 6 ns 90% 50% VCC 10% tHZ 90% VOH GND GND
S1
VIN
Waveform - A
Item tZH tZL tHZ tLZ
S1 VCC GND VCC GND
S2 GND VCC GND VCC
VOUT
Waveform - B
tZL 50%
tLZ 10%
VCC VOL
Notes: 1. Waveform - A is for an output with internal conditions such that the output is high except when disabled by the output control. 2. Waveform - B is for an output with internal conditions such that the output is low except when disabled by the output control.
* Maximum control frequency
VCC VC VC VCC VIN = VCC GND VOUT RL = 1 k CL = 15 pF VCC GND
VOUT
VCC/2
* CIN/OUT, CIN-OUT
CIN-OUT
VC = GND
VCC
VCC (OFF) CIN/OUT GND CIN/OUT
Rev.8.00, Jan.27.2004, page 7 of 8
HD74HC1G66
Package Dimensions
Unit: mm
(0.65)
(0.65)
(0.425)
1.3 0.2
0.15- 0.05
2.1 0.3
+ 0.1
1.25 0.1
0 - 0.1
2.0 0.2
0.9 0.1
(0.2)
(0.425)
5 - 0.2 0.05
Package Code JEDEC JEITA Mass (reference value)
CMPAK-5V -- Conforms 0.006 g
Rev.8.00, Jan.27.2004, page 8 of 8
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0


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